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Directory Results for CYPRESS SEMICONDUCTOR PRODUCT CHANGE NOTIFICATION PCN: 000006 DATE: February 18, 2000 Subject: Assembly Molding Compound Change, TQFP packages To: Category: Level: Description of change: Cypress has qualified a molding compound change on to CYPRESS SEMICONDUCTOR PRODUCT CHANGE NOTIFICATION PCN: 000014 DATE: March 30, 2000 Subject: Assembly Location Change, 48 lead 7 x 7 mm FBGA package To: Category: Level: Description of change: Cypress Semiconductor Philippines (CSPI)

CYPRESS SEMICONDUCTOR PRODUCT CHANGE NOTIFICATION PCN: 000006 DATE: February 18, 2000 Subject: Assembly Molding Compound Change, TQFP packages To: Category: Level: Description of change: Cypress has qualified a molding compound change on
CYPRESS SEMICONDUCTOR PRODUCT CHANGE NOTIFICATION PCN: 000007 DATE: February 29, 2000 Subject: Alternate Assembly Location for 44 and 84lead PLCC CY37000 Family To: Category: Level: Description of change: Cypress will use Alphatec in
CYPRESS SEMICONDUCTOR PRODUCT CHANGE NOTIFICATION PCN: 000010 DATE: March 20, 2000 Subject: SRAM, 4Meg 3
CYPRESS SEMICONDUCTOR PRODUCT CHANGE NOTIFICATION PCN: 000014 DATE: March 30, 2000 Subject: Assembly Location Change, 48 lead 7 x 7 mm FBGA package To: Category: Level: Description of change: Cypress Semiconductor Philippines (CSPI)