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35 NOM 0. 30 MIN SEATING PLANE COPLANARITY BALL DIAMETER COMPLIANT TO JEDEC STANDARDS MO-205 WITH THE EXCEPTION TO PACKAGE BALL THICKNESS. 061708-A a. 20 19. 00 SQ 18. 80 22 20 18 16 14 12 10 8 6 4 2 23 21 19 17 15 13 11 9 7 5 3 1 A C E G 17. 60 BSC SQ J L N R BSC TOP VIEW U W B D F H K M P T V Y AA AB AC BOTTOM VIEW DETAIL A NOM 0. A1 BALL CORNER 425-Ball Chip Scale Package Ball Grid Array CSPBGA BC-425-1 Dimensions shown in millimeters 19.
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How to fill out cspbga form
How to Fill out CSPBGA:
01
Start by gathering all the necessary materials for filling out a CSPBGA (Chip-Scale Package Ball Grid Array). This includes the CSPBGA itself, solder paste, a stencil, a soldering iron or reflow oven, flux, and any necessary cleaning supplies.
02
Begin by preparing the CSPBGA by cleaning it thoroughly to ensure there is no debris or contamination that could affect the soldering process. Use a lint-free cloth or an appropriate cleaning solution to wipe the surface of the CSPBGA.
03
Next, set up the stencil on top of the CSPBGA. The stencil will help in distributing the solder paste evenly onto the corresponding pads on the package. Align the stencil properly and secure it in place.
04
Apply the solder paste onto the stencil and use a squeegee to spread it across the stencil, ensuring that the paste fills the openings completely. This step is crucial as it determines the quality of the solder joints.
05
Carefully lift the stencil away from the CSPBGA, leaving behind a precise and even distribution of solder paste on the package. Inspect the alignment of the paste and make any necessary adjustments if needed.
06
Now, it's time to place the components onto the prepared CSPBGA. Take extra precautions to ensure accurate alignment and avoid damaging the paste. Place the components gently onto the solder paste, matching them with their designated pads.
07
Once all the components are in place, it's time to solder the CSPBGA. This can be done using a soldering iron or by subjecting the package to a reflow oven, depending on the specific requirements and equipment available. Follow the manufacturer's instructions for the appropriate temperature profile and duration.
08
After the soldering process is complete, it's essential to clean the CSPBGA to remove any potential residues, flux, or contaminants. Use an appropriate cleaning solution or isopropyl alcohol to ensure the package is thoroughly cleaned without causing any damage.
Who Needs CSPBGA:
01
Electronic manufacturers: CSPBGAs are commonly used in various electronic devices and applications due to their compact size, high-density interconnections, and excellent thermal properties. Electronic manufacturers often require CSPBGAs for integrating multiple components into compact spaces, such as smartphones, tablets, or wearables.
02
PCB designers: PCB designers often choose CSPBGAs when working on projects with limited available space or requiring high-density interconnections. The small footprint of the CSPBGA allows designers to optimize PCB layouts and achieve greater miniaturization.
03
Engineers and technicians: Engineers and technicians working in the electronics industry may require CSPBGAs for prototyping, testing, or repairing electronic circuits. CSPBGAs offer a reliable packaging solution, allowing for efficient assembly and maintenance processes.
In conclusion, filling out a CSPBGA involves preparing the package, applying solder paste with a stencil, placing components accurately, soldering, and cleaning the package. CSPBGAs are widely used by electronic manufacturers, PCB designers, and engineers in various industries.
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