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US006144089A Bulleted States Patent 19 11 Patent Number: Crisis 45 54 6,144,089 Date of Patent: *Nov. 7, 2000 INNERDIGITIZEI) BOND FINGERS ()N BUS BARS ()F SEMICONDUCTOR DEVICE 5,438,478 5,508,565
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Inner-digitized bond fingers refer to the small metallic contacts located on electronic devices, such as printed circuit boards, that provide connection points for wires or components. These bond fingers are typically used in advanced packaging technologies.
There is no specific filing requirement for inner-digitized bond fingers. However, manufacturers or electronics assembly companies that utilize inner-digitized bond fingers in their products may need to provide documentation or specifications related to the use and implementation of these components.
As mentioned earlier, there is no specific form or filing process for inner-digitized bond fingers. If documentation or specifications are required, they can be provided in the format requested by the manufacturer or electronics assembly company.
Inner-digitized bond fingers serve the purpose of facilitating electrical connections between various components within electronic devices. They ensure reliable and efficient transmission of signals or power between different parts of the device.
Since there is no specific reporting requirement for inner-digitized bond fingers, there is no set information that needs to be reported. However, manufacturers or electronics assembly companies may request information related to the dimensions, materials, and specifications of the bond fingers being used.
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