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US 20100320585A1 (19) United States (12) Patent Application Publication (10) Pub. No.: US 2010/0320585 A1 (43) Pub. Date: Jiang et al. (54) Related US. Application Data PACKAGED INTEGRATED CIRCUIT
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What is packaged integrated circuit devices?
Packaged integrated circuit devices are electronic components that consist of an integrated circuit (IC) housed in a protective package. These devices are used in a wide range of electronic applications, such as computers, smartphones, and automotive systems.
Who is required to file packaged integrated circuit devices?
The manufacturers or importers of packaged integrated circuit devices are required to file the necessary documentation and reports with the regulatory authorities.
How to fill out packaged integrated circuit devices?
Filling out packaged integrated circuit devices typically involves providing relevant information about the manufacturer or importer, details of the integrated circuit device, packaging specifications, and compliance certifications. This information is usually submitted through the designated regulatory filing system or platform.
What is the purpose of packaged integrated circuit devices?
Packaged integrated circuit devices serve as the building blocks for electronic systems and devices. They enable the integration of complex circuitry and components into compact and easily deployable packages, facilitating the development of advanced electronic products and technologies.
What information must be reported on packaged integrated circuit devices?
The information that must be reported on packaged integrated circuit devices may include the manufacturer or importer details, device specifications, packaging details, compliance certifications, and any other relevant information required by the regulatory authorities.
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