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Microsystem Technologies 7 (2001) 55 62 Springer-Verlag 2001 A flexible encapsulated MEMO pressure sensor system for biomechanical applications N. K. S. Lee, R. S. Goonetilleke, Y. S. Cheung, G. M.
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What is mems pressure sensor packaging?
MEMS pressure sensor packaging refers to the process of enclosing a MEMS pressure sensor in a protective packaging material, such as a plastic or ceramic casing, to ensure its reliability and functionality in various applications.
Who is required to file mems pressure sensor packaging?
Manufacturers or suppliers of MEMS pressure sensors are typically required to file information on their packaging to comply with regulatory requirements and industry standards.
How to fill out mems pressure sensor packaging?
To fill out MEMS pressure sensor packaging, manufacturers or suppliers need to provide information such as the type of packaging material used, dimensions of the package, sealing methods, and any specific instructions or warnings related to the packaging.
What is the purpose of mems pressure sensor packaging?
The purpose of MEMS pressure sensor packaging is to protect the delicate internal components of the sensor from external influences such as dust, moisture, and mechanical stress. It also helps in providing a standardized interface for integration into various electronic systems.
What information must be reported on mems pressure sensor packaging?
The information that must be reported on MEMS pressure sensor packaging may include the manufacturer's name or logo, product model number, batch or serial number, electrical and mechanical specifications, and compliance marks or certifications indicating adherence to certain standards.
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