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US 20040087129A1 (19) United States (12) Patent Application Publication (10) Pub. No.: US 2004/0087129 A1 (43) Pub. Date: Chen et al. (54) SOLDER BUMP STRUCTURE AND LASER May 6, 2004, Publication
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How to fill out solder bump structure and:

01
Start by preparing the surface of the substrate where the solder bumps will be applied. Ensure it is clean and free from any contaminants.
02
Apply a layer of flux to the substrate surface. Flux helps to remove any oxidation and promotes better solder wetting.
03
Place solder paste or solder preforms onto the fluxed areas of the substrate. Make sure to align them properly with the designated locations.
04
Use a reflow oven or a hot plate to heat the substrate and initiate the solder melting process. The solder will flow and form the desired solder bump shape.
05
After the reflow process, allow the solder bumps to cool down and solidify. Inspect them to ensure they have formed correctly and have the desired shape and height.

Who needs solder bump structure and:

01
Electronics manufacturers: Solder bump structures are commonly used in semiconductor packaging and electronic assembly processes. They provide electrical connections between microchips and circuit boards, enabling proper functioning of electronic devices.
02
Integrated circuit (IC) designers: Solder bump structures are essential for mounting ICs onto substrates. They allow for efficient and reliable electrical connections, ensuring the proper functionality of the ICs.
03
Research and development teams: Scientists and engineers working on advanced electronic technologies often require solder bump structures for prototyping and testing purposes. They enable the development of next-generation electronic devices and systems.
Overall, anyone involved in the production, design, or research of electronic devices can benefit from solder bump structures to ensure reliable electrical connections and optimal performance.
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Solder bump structure refers to the arrangement of solder bumps on a semiconductor chip.
Manufacturers of semiconductor chips are required to file solder bump structure information.
Solder bump structure information can be filled out electronically through the appropriate regulatory agencies.
The purpose of solder bump structure filing is to provide transparency and ensure the safety of semiconductor chips.
The solder bump structure filing must include details on the size, shape, and composition of the solder bumps.
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