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US 20110286273A1 (19) United States (12) Patent Application Publication (10) Pub. No.: US 2011/0286273 A1 YANG et al. (54) (43) Pub. Date: SEMICONDUCTOR DEVICE AND METHOD Publication Class?cation
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Start by gathering all the necessary materials and components required for the semiconductor device and method. This may include the semiconductor material, substrate, electrodes, and any additional materials needed for the specific method being used.
02
Carefully clean the substrate to ensure it is free from any contaminants that could affect the performance of the semiconductor device. This can be done using appropriate cleaning solutions and techniques.
03
Prepare the semiconductor material by cutting it into the desired shape and size. This may involve using specialized tools such as a diamond saw or laser cutter.
04
Apply a thin layer of a suitable material, such as silicon dioxide or a photoresist, onto the substrate. This will serve as a protective layer or a mask for the subsequent processing steps.
05
Use a deposition technique, such as physical vapor deposition or chemical vapor deposition, to deposit the semiconductor material onto the prepared substrate. The specific deposition method will depend on the type of semiconductor material being used.
06
Once the semiconductor material has been deposited, use photolithography techniques to define the desired patterns and features on the semiconductor device. This involves exposing the photoresist to light through a patterned mask and developing it to create the desired features.
07
After the patterns have been defined, use suitable techniques such as etching or doping to modify the properties of the semiconductor material to achieve the desired functionality. This may involve selectively removing or adding material to create specific electronic structures.
08
Finally, perform any necessary testing and characterization of the semiconductor device to ensure its proper functionality. This may include electrical measurements, optical analysis, or performance testing under different conditions.

Who needs semiconductor device and method?

01
Researchers and scientists involved in semiconductor technology and device fabrication require semiconductor devices and methods to study and develop new materials, structures, and functionalities.
02
Electronics manufacturers and companies in industries such as telecommunications, consumer electronics, and automotive rely on semiconductor devices and methods to manufacture electronic components and systems.
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Semiconductor device engineers and designers use semiconductor devices and methods to create innovative solutions for various applications, including integrated circuits, microprocessors, sensors, and photovoltaic devices.
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Academics and educators teaching courses related to semiconductor physics and electronics utilize semiconductor devices and methods to provide practical demonstrations and laboratory exercises for their students.
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Technicians and engineers involved in semiconductor device testing and quality control rely on semiconductor devices and methods to ensure the reliability and performance of the manufactured devices.
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Semiconductor device and method refers to a device and method used in the production of semiconductors, which are electronic components used in various devices.
Manufacturers and companies involved in the production of semiconductor devices are required to file semiconductor device and method.
Semiconductor device and method can be filled out by providing detailed information about the manufacturing process, materials used, and intended use of the semiconductor devices.
The purpose of semiconductor device and method is to ensure transparency in the production of semiconductor devices and to track the use of materials in the manufacturing process.
Information such as manufacturing process, materials used, specifications of the semiconductor devices, and intended use must be reported on semiconductor device and method.
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