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Advance Program, Exhibition Information and Registration online: www.imaps.org/hitec MAPS International Conference and Exhibition on High Temperature Electronics (Hi TEC 2010) May 1113, 2010 Hyatt
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The IMAPS International Conference and Exhibition is the premier event for the Microelectronics Packaging, Interconnect and Assembly community.
Any individual or organization involved in Microelectronics Packaging, Interconnect and Assembly is required to file for the IMAPS International Conference.
To fill out the IMAPS International Conference application, you need to visit the official website and complete the online registration form.
The purpose of the IMAPS International Conference and Exhibition is to bring together professionals in the field of Microelectronics Packaging, Interconnect and Assembly to network, share knowledge, and explore new technologies.
The IMAPS International Conference application requires information such as contact details, organization name, presentation topic, and any special requirements.
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