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2V N.C. Not connected GND Ground VCCAUX Auxiliary supply voltage SUSPEND Dedicated SUSPEND and dual-purpose AWAKE Power Management pins The 256-ball fine-pitch thin ball grid array package FTG256 supports the XC3S50AN XC3S200AN and XC3S400AN devices. Type. These pins are also indicated in Figure 20. XC3S400AN devices for migration between these devices in the FTG256 package. The XC3S200AN and XC3S400AN have identical pinouts. The XC3S50AN pinout ...

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What is xc3s200an ftg256 form?

The xc3s200an ftg256 form is a specific electronic component package form for a Field-Programmable Gate Array (FPGA) device. It refers to the package type of the XC3S200AN FPGA, which utilizes 256 pins in a Fine-Pitch Ball Grid Array (FBGA) package.

Who is required to file xc3s200an ftg256 form?

The xc3s200an ftg256 form is not something that needs to be filed or filled out by individuals or organizations. It is a technical specification related to the package type of a specific FPGA device and is typically used and referenced by engineers, designers, and manufacturers working with FPGA technology.

How to fill out xc3s200an ftg256 form?

There is no specific form or documentation that needs to be filled out for the xc3s200an ftg256 form. It is a technical specification for a package type used in FPGA devices. If you are working with the XC3S200AN FPGA, you would need to ensure that you select or design the appropriate package type and use the necessary tools and techniques to incorporate it into your circuit design or system.

What is the purpose of xc3s200an ftg256 form?

The purpose of the xc3s200an ftg256 form is to provide a standardized reference for the package type of the XC3S200AN FPGA device. It helps engineers, designers, and manufacturers understand the physical characteristics and pin configuration of the package so that they can properly integrate the FPGA into their designs and systems.

What information must be reported on xc3s200an ftg256 form?

The xc3s200an ftg256 form does not involve reporting any specific information. It is a technical specification for a package type used in FPGA devices. The form provides details such as pin count, pin configuration, and physical dimensions for the XC3S200AN FPGA package.

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