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PRODUCT SUBMITTAL ...................................................... WIDEBAND Clip All WIDEBAND seismic products meet Uniform Building Code requirements listed in 1403.6.4.2. In seismic zones
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How to fill out wirebond clip?

01
Start by gathering all the necessary materials, including the wirebond clip, wirebond substrate, and wirebonding machine.
02
Place the wirebond substrate onto the wirebonding machine and ensure it is secured in place.
03
Carefully align the wirebond clip over the designated area on the wirebond substrate.
04
Gently press down on the wirebond clip to attach it securely to the substrate.
05
Use the wirebonding machine to bond the wires onto the wirebond clip, following the specific instructions provided by the manufacturer.

Who needs wirebond clip?

01
The wirebond clip is commonly used in the electronics industry for various applications, such as in semiconductor packaging and microelectronic assembly.
02
Professionals and technicians involved in wirebonding processes rely on wirebond clips to securely hold and connect wires to substrates.
03
Manufacturers of electronic devices, such as integrated circuits and microchips, often require wirebond clips to ensure reliable connections between components.
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Wirebond clip is a type of fastener used in electronic packaging to connect a wire to a terminal or pad.
Manufacturers or assemblers of electronic components may be required to file wirebond clip.
Wirebond clip can typically be filled out electronically or on paper, providing information such as part number, quantity, and date of production.
The purpose of wirebond clip is to securely connect a wire to a terminal or pad for electronic applications.
Information such as part number, quantity, date of production, and any special instructions must be reported on wirebond clip.
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