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Things are moving really fast at the moment as this year we see both Fan-out wafer level packaging and chip embeddeding into PCB laminate infrastructures emerging at the same time ramping to high volume production. 1st generation eWLB cross-section Courtesy of Infineon Fan-Out WLP technology is emerging on both 200mm / 300mm infrastructures Infineon is having a great sucess with its proprietary eWLB technology the first FO-WLP wafers are mass produced on 200mm both at Infineon STATS ChipPAC...

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What is embedded wafer-level-packages?

Embedded wafer-level-packages are integrated circuits or chips that are packaged at the wafer level before being separated into individual components.

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Manufacturers or importers of embedded wafer-level-packages are required to file.

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Embedded wafer-level-packages can be filled out electronically through the designated platform provided by the regulatory authority.

What is the purpose of embedded wafer-level-packages?

The purpose of embedded wafer-level-packages is to ensure traceability and compliance of integrated circuits or chips throughout the supply chain.

What information must be reported on embedded wafer-level-packages?

Information such as product type, quantity, manufacturer/importer details, and intended use must be reported on embedded wafer-level-packages.

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