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C cile Venet Schneider Electric Michel Cabrera INSA Lyon Laboratoire Amp re Ga l Depres Arjowiggins Georges Hadziioannou Universit de Bordeaux LCPO Ma l Moguedet S2P Didier Muller Sintex NP Nathalie P coul Groupe SEB Nad ge Reverdy-Bruas LGP2 Chaire MINT Contact Chantal Sohm SFIP Tel. 33 1 46 53 10 74 With the support of Chair MINT Grenoble INP Foundation programme - Wednesday March 8 2017 Welcome and attendees registration Welcome opening by SFIP and Chair MINT Grenoble INP Foundation...
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Plastronics Amp 3D-MID is a technology that combines plastic and electronics to create three-dimensional molded interconnect devices.
Manufacturers and designers of electronic devices that utilize Plastronics Amp 3D-MID technology are required to file.
To fill out Plastronics Amp 3D-MID, manufacturers and designers need to provide detailed information about the electronic components, materials used, and manufacturing process.
The purpose of Plastronics Amp 3D-MID is to create compact and lightweight electronic devices with integrated circuits and components.
Information such as design specifications, material properties, manufacturing processes, and testing results must be reported on Plastronics Amp 3D-MID.
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