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JE DEC STANDARD Mechanical Shock JESD22-B104C (Revision of JESD22-B104-B) DECEMBER 2004 JE DEC SOLID STATE TECHNOLOGY ASSOCIATION Solid State Technology Association NOTICE JE DEC standards and publications

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What is jesd22 b104?

JESD22-B104 is a standard established by JEDEC for testing the reliability of semiconductor devices, specifically focusing on wet stress testing of packaged devices to assess their durability and performance under moisture-related stress.

Who is required to file jesd22 b104?

Manufacturers of semiconductor devices and components who wish to demonstrate the reliability and compliance of their products to moisture-related standards are required to file JESD22-B104.

How to fill out jesd22 b104?

To fill out JESD22-B104, manufacturers must follow the guidelines specified in the standard, which typically includes documenting the testing conditions, samples used, duration of exposure, and results pertaining to moisture absorption and reliability assessments.

What is the purpose of jesd22 b104?

The purpose of JESD22-B104 is to establish a standardized method for evaluating the moisture sensitivity of semiconductor devices to ensure that they can withstand varying environmental conditions throughout their lifecycle.

What information must be reported on jesd22 b104?

JESD22-B104 requires reporting information such as device type, test conditions, moisture sensitivity level (MSL), test results, failure rates, and any deviations from the standard testing procedures.