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Safety Data Sheet Material Name: TENS; Revision date: 20180917Compliant with GB/T 16483 and GB/T 17519 SDS ID: ADC09230 (CHINA) Version 4.0Section 1 PRODUCT AND COMPANY IDENTIFICATION Product identifier
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How to fill out bare diecsp trays

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How to fill out bare diecsp trays

01
Start by selecting the appropriate bare die CSP tray for your specific application.
02
Ensure that the tray is clean and free from any dust or contaminants.
03
Carefully place the bare die CSPs into the designated pockets on the tray.
04
Make sure that each die is properly aligned with the pocket and is not touching any other die.
05
Use caution when handling the bare die CSPs to avoid any damage or contamination.
06
Once all the die have been placed in the tray, double-check to ensure that none are missing or misplaced.
07
Close the tray securely to prevent any movement or shifting of the die during transportation or storage.
08
Store the filled bare die CSP tray in a clean and controlled environment to maintain the integrity of the die.
09
Follow any specific handling or storage guidelines provided by the manufacturer of the bare die CSPs.
10
When it comes time to use the die, carefully remove them from the tray and follow the necessary assembly or testing procedures.

Who needs bare diecsp trays?

01
Bare die CSP trays are commonly used by semiconductor manufacturers, electronics assembly companies, and research institutions that work with bare die components.
02
These trays provide a safe and organized way to handle and store bare die CSPs during manufacturing, testing, and assembly processes.
03
They can also be used by individuals or hobbyists who work with bare die components and need a reliable method for storage and transportation.
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Bare diecsp trays refer to semiconductor trays without any added components or packaging.
Manufacturers and distributors of bare diecsp trays are required to file them.
Bare diecsp trays can be filled out by providing detailed information about the semiconductor trays, such as quantity, dimensions, and specifications.
The purpose of bare diecsp trays is to track and document the distribution of semiconductor trays without any additional components.
Information such as batch number, date of manufacture, and supplier details must be reported on bare diecsp trays.
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