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ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES IPC4552 Specification for Electrodes Nickel/Immersion Gold (ENID) Plating for Printed Circuit BoardsIPC4552 October 2002A standard developed by IPC 2215

How to fill out electroless nickel immersion gold

How to fill out electroless nickel immersion gold

1. To fill out electroless nickel immersion gold, follow these steps:
2. Clean the substrate surface to remove any dirt, grease, or oxides using a suitable cleaning solution.
3. Rinse the substrate thoroughly with deionized water to remove any residue from the cleaning solution.
4. Activate the substrate surface by immersing it in a suitable activation solution. This step helps in creating uniform and adhesive catalytic sites on the surface.
5. Rinse the substrate again with deionized water to remove any residue from the activation solution.
6. Immerse the activated substrate in the electroless nickel bath containing the appropriate chemicals. This bath contains a reducing agent, a nickel source, and stabilizers.
7. Allow the substrate to stay in the bath for the desired duration to ensure proper coating deposition. The duration may vary depending on the desired thickness of the nickel layer.
8. Rinse the substrate with deionized water after removing it from the electroless nickel bath to remove excess chemicals.
9. Immerse the substrate in the immersion gold bath containing suitable chemicals that will deposit a thin layer of gold on the nickel layer.
10. Keep the substrate in the immersion gold bath for the recommended time to ensure proper gold deposition.
11. Rinse the substrate with deionized water to remove any residual chemicals.
12. Dry the substrate thoroughly before further processing or usage.

Who needs electroless nickel immersion gold?

1. Electroless nickel immersion gold is commonly used in the electronics industry for various applications and is needed by:
2. - Printed Circuit Board (PCB) manufacturers to enhance the solderability and corrosion resistance of PCBs.
3. - Electronic component manufacturers to provide a reliable and durable surface finish for their products.
4. - Aerospace and defense industries for their critical electronic assemblies, where high-performance and reliability are crucial.
5. - Automotive electronics manufacturers to improve the performance and longevity of electronic components used in vehicles.
6. - Telecommunication equipment manufacturers to ensure high-quality connections and longevity of their products.
7. - Any industry or application that requires a reliable, uniform, and corrosion-resistant surface finish for their electronic devices.

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What is electroless nickel immersion gold?

Electroless nickel immersion gold is a type of surface finish used in the electronics industry to protect and enhance the connectivity of printed circuit boards.

Who is required to file electroless nickel immersion gold?

Manufacturers and suppliers in the electronics industry who use electroless nickel immersion gold as a surface finish are required to report it.

How to fill out electroless nickel immersion gold?

The process of filling out electroless nickel immersion gold involves providing detailed information about the usage and application of the surface finish on printed circuit boards.

What is the purpose of electroless nickel immersion gold?

The purpose of electroless nickel immersion gold is to provide a durable and reliable surface finish that enhances the performance and longevity of printed circuit boards.

What information must be reported on electroless nickel immersion gold?

Information such as the quantity of electroless nickel immersion gold used, the manufacturer or supplier of the surface finish, and the specific applications of the surface finish must be reported.