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Pan Pacific Microelectronics Symposium 2013 January 2224, 2013 Beach and Golf Resort, Maui, Hawaii Exclusive Promotional Packages Pan PAC Corporate Package $2250. Ultimate visibility throughout SMT
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Pan Pacific Microelectronics Symposium is an international conference dedicated to the advancement of microelectronics and electronic packaging technologies.
Researchers, engineers, and industry professionals involved in microelectronics and electronic packaging are required to participate in and present at the symposium.
To fill out the symposium, participants need to submit abstracts, papers, presentations, and posters related to their research or work in the field of microelectronics.
The purpose of the symposium is to facilitate the exchange of knowledge, ideas, and innovations in the field of microelectronics and electronic packaging among industry professionals, researchers, and engineers.
Participants must report on their research findings, technological advancements, and case studies related to microelectronics and electronic packaging technologies.
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