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Process Change Notice#20210119976210119976 Addendum to 201104879 8/16LSOIC150mils Additional Assembly, Test and Ship PCN Issue Date: 1/19/2021Effective Date:2/10/2021PCN Type: Addendum; Assembly Description
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01
Ensure you have the necessary equipment and components ready for the assembly test.
02
Carefully follow the instructions provided in the SOIC-150mils additional assembly test documentation.
03
Begin by placing the SOIC-150mils package on the designated area of the test board.
04
Connect any required testing equipment to the SOIC-150mils package according to the test instructions.
05
Power on the test equipment and follow the specified procedures to perform the assembly test.
06
Record and analyze the test results to determine the functionality and quality of the assembly.

Who needs soic-150mils additional assembly test?

01
Manufacturers and producers of electronic components or devices may need SOIC-150mils additional assembly tests to ensure the quality and functionality of their products.
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The SOIC-150mils additional assembly test is a standard evaluation procedure for assessing the assembly quality of semiconductor devices, specifically those with a 150 mil package size.
Manufacturers and suppliers of semiconductor devices that utilize the SOIC-150mils package size are required to file the additional assembly test.
To fill out the SOIC-150mils additional assembly test, complete the prescribed form by providing information about the device, assembly procedures, materials used, and results of previous testing, followed by signature and date.
The purpose of the SOIC-150mils additional assembly test is to ensure that semiconductor assemblies meet quality and performance standards before they are released to the market.
The information required includes device identification, assembly process details, material specifications, test results, and compliance with industry standards.
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