Get the free Subdivision Platting Application - City of Ionia
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Subdivision Platting Application Submit Applications to City Hall Street Address: 114 North Kidd Street Ionic, MI 48846 Mailing Address: P.O. Box 496 Ionic, MI 48846 pH: (616) 5274170 Website: www.ci.ionia.mi.us
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How to fill out subdivision platting application
How to fill out subdivision platting application
01
Obtain a copy of the subdivision regulations from the local planning department.
02
Complete the application form with all required information, including property details, proposed lot layout, and any required supporting documents.
03
Submit the completed application form along with any required fees to the local planning department for review.
04
Attend any meetings or hearings related to the application as required by the local planning department.
05
Await a decision on the application from the local planning department before proceeding with any development activities.
Who needs subdivision platting application?
01
Developers looking to subdivide a parcel of land into multiple lots for development.
02
Property owners seeking to divide their land for sale or development purposes.
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What is subdivision platting application?
Subdivision platting application is the process of dividing a piece of land into smaller lots or parcels for development purposes.
Who is required to file subdivision platting application?
Property owners or developers are required to file subdivision platting application.
How to fill out subdivision platting application?
Subdivision platting application can be filled out by providing detailed information about the proposed subdivision, including lot sizes, roadways, utilities, etc.
What is the purpose of subdivision platting application?
The purpose of subdivision platting application is to ensure that new developments meet zoning regulations, building codes, and other land use requirements.
What information must be reported on subdivision platting application?
Information such as lot dimensions, proposed road layouts, utility plans, and drainage systems must be reported on subdivision platting application.
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