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MATERIAL SAFETY DATA SHEET according to EC 1272/2008 [CLP] LEADED ROSINED SOLDER PASTEVERSION NO:1REVISION:20171113SECTION 1: PRODUCT AND COMPANY IDENTIFICATION 1.1 Product Identifier Product name:
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How to fill out lead solder paste

01
Prepare the PCB by applying flux to the areas where solder paste will be used.
02
Place the stencil over the PCB and secure it in place.
03
Scoop some lead solder paste onto the stencil.
04
Use a squeegee to evenly spread the solder paste over the stencil openings.
05
Carefully lift the stencil off the PCB, leaving behind the solder paste.
06
Inspect the PCB to ensure the solder paste is applied correctly before placing components.

Who needs lead solder paste?

01
Manufacturers of electronic devices and PCBs typically need lead solder paste for soldering components onto circuit boards.
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Lead solder paste is a mixture of tiny solder particles mixed with flux, used in electronics manufacturing to create connections between components.
Manufacturers and distributors of products containing lead solder paste are required to file lead solder paste.
Lead solder paste should be filled out by providing information on the quantity and usage of lead solder paste in products.
The purpose of lead solder paste is to create reliable and durable electrical connections in electronic devices.
Information such as the quantity of lead solder paste used, the types of products it is used in, and any relevant environmental impact data must be reported on lead solder paste.
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