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THINKING INTEGRATED PASSIVE DEVICES Market & Technology report January 2018Driven by application diversification, IDs (integrated passive devices) continue their promising growth. KEY FEATURES OF
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Deposit the thin film material onto the substrate using techniques such as sputtering or evaporation.
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Thin film integrated passive refers to passive components that are integrated directly into the thin film layers of a semiconductor substrate.
Manufacturers or companies that produce or use thin film integrated passive components are required to file the necessary documentation.
To fill out thin film integrated passive documentation, companies need to provide detailed information about the components, materials used, production process, and any relevant testing or certification.
The purpose of thin film integrated passive components is to provide essential functionalities in a compact and efficient manner within a semiconductor device or system.
Information such as component specifications, production methods, materials used, quality control measures, and compliance with industry standards must be reported on thin film integrated passive documentation.
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