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IEC TS 626474 Edition 1.0 201804TECHNICAL SPECIFICATIONProcess management for avionics Aerospace and defence electronic systems containing leadfree solder Part 4: Ball grid array (BGA) reballingINTERNATIONAL ELECTROTECHNICAL COMMISSIONICS
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Any organization or individual involved in the design, development, testing, or implementation of electronic components or systems may need to adhere to the IEC TS 62647-4 process.
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Manufacturers, engineers, technicians, quality assurance personnel, and regulatory agencies are examples of entities that may require compliance with this process.
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The IEC TS 62647-4 process is a technical specification that provides guidelines for assessing the reliability of electronic components used in automotive applications, specifically focusing on failure mechanisms and testing procedures.
Manufacturers and suppliers of electronic components used in automotive applications are generally required to file the IEC TS 62647-4 process as part of compliance with industry standards.
To fill out the IEC TS 62647-4 process, companies should collect relevant data on their components, conduct necessary tests as outlined in the specification, and submit a report that details these assessments and compliance with the requirements.
The purpose of the IEC TS 62647-4 process is to ensure the reliability and safety of electronic components in automotive applications by providing a standardized methodology for testing and reporting on component performance.
Information that must be reported includes test results, failure analysis, reliability assessments, and compliance with the specified testing methodologies outlined in IEC TS 62647-4.
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