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Revision Date: 07/03/2022 Revision #: 3SAFETY DATA SHEETACCORDING TO ECREGULATIONS 1907/2006 (REACH), 1272/2008 (CLP) & 2015/830 SECTION 1: IDENTIFICATION OF THE SUBSTANCE/MIXTURE AND OF THE COMPANY/UNDERTAKING
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01
Prepare the substrate by cleaning it thoroughly to ensure it is free of any contaminants.
02
Set up the slot-die deposition system according to the manufacturer's instructions.
03
Prepare the deposition material and load it into the slot-die reservoir.
04
Adjust the parameters such as flow rate, speed, and temperature for the desired deposition thickness and uniformity.
05
Start the deposition process and carefully monitor the quality of the film as it is being deposited.
06
Once the deposition is complete, carefully remove the substrate from the system and allow the film to cure or dry as needed.

Who needs sequential slot-die deposition of?

01
Researchers and scientists working in the fields of thin film deposition and material science.
02
Manufacturers looking to create thin films with precise control over thickness and uniformity.
03
Companies interested in producing electronic devices, solar cells, or other advanced materials.
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Sequential slot-die deposition is a method used for thin film deposition in a continuous and controlled manner.
Researchers, manufacturers, or organizations using this deposition method are required to file sequential slot-die deposition.
To fill out sequential slot-die deposition, detailed information about the deposition process, materials used, deposition parameters, and outcomes must be provided.
The purpose of sequential slot-die deposition is to create thin films with precise thickness and uniformity for various applications such as electronics, solar cells, and sensors.
Information such as deposition parameters (speed, temperature, pressure), material properties, substrate type, film thickness, and quality must be reported on sequential slot-die deposition.
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