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Indian Institute of Technology JodhpurTENDER FOR PROCUREMENT OF Supply and Installation of
Semiautomatic Wire Border
Bids to be submitted online (PPP)
For
(Technical and Financial bid as per schedule
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How to fill out semi-automatic wire bonder
How to fill out semi-automatic wire bonder
01
Power on the semi-automatic wire bonder and allow it to warm up.
02
Load the wire spool onto the machine, making sure it is securely in place.
03
Adjust the bonding parameters such as bonding force and bonding time according to the requirements of the bond.
04
Load the substrate onto the designated area of the machine, ensuring it is aligned properly.
05
Use the machine's controls to position the wire over the bond pad on the substrate.
06
Lower the bonding tool onto the wire to make the bond, following the specified bonding process.
07
Repeat the process for each wire bond needed on the substrate.
08
Once all bonds are completed, remove the substrate and inspect the bonds for quality.
Who needs semi-automatic wire bonder?
01
Electronic manufacturers who require precise and reliable wire bonding in their production processes.
02
Research and development laboratories working on semiconductor devices that need wire bonding for testing.
03
Companies or individuals who need to repair or modify electronic devices with wire bonding connections.
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What is semi-automatic wire bonder?
Semi-automatic wire bonder is a machine used in the semiconductor industry for connecting integrated circuits to the package or substrate using thin wires.
Who is required to file semi-automatic wire bonder?
Companies or manufacturers in the semiconductor industry who use semi-automatic wire bonders are required to file.
How to fill out semi-automatic wire bonder?
The form for filing semi-automatic wire bonders typically requires information about the machine, its usage, and the company using it.
What is the purpose of semi-automatic wire bonder?
The purpose of semi-automatic wire bonder is to ensure proper connection of integrated circuits in semiconductor devices.
What information must be reported on semi-automatic wire bonder?
Information such as machine specifications, usage hours, maintenance records, and user details may need to be reported on semi-automatic wire bonder.
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