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Open Innovation PlatformTMOpen Innovation PlatformTM (OIP) Overview The TSMC Open Innovation Platform is a comprehensive design technology infrastructure that encompasses all critical IC implementation
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TSMC OIP (Open Innovation Platform) enabling industry refers to a framework set by TSMC that promotes collaboration and innovation among design partners and ecosystem participants to enhance semiconductor design and manufacturing capabilities.
Companies and organizations that engage in collaborative design or development activities within the TSMC ecosystem are required to file TSMC OIP enabling industry.
To fill out TSMC OIP enabling industry, organizations should gather necessary information related to their partnership, technology, and innovation contributions, then complete the official filing forms provided by TSMC, ensuring all details are accurate and submitted on time.
The purpose of TSMC OIP enabling industry is to streamline collaboration, foster technological advancements, and facilitate the sharing of resources and knowledge among semiconductor industry stakeholders.
Companies must report details such as project objectives, collaboration details, technology contributions, and any intellectual property involved in the OIP activities.
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